I had a quick look at this device's datasheet, and the only difference between the H and the HQ versions seems to be that the HQ is tinned with lead based solder, so it's not "lead free" as is required these days for commercial use. But for your purposes it really makes no odds - go for either and you'll be fine!

It also said that the rear of the chip is metal and connected internally, so you need to take precautions. However depending on what the heatsink is connected to, then it may have been designed to be non insulated, as that part of the chip appeared to be grounded. But just be aware of the options here!